Singapore -- DENSELIGHT (a POET Technologies company), a leading provider of Indium Phosphide (InP) optical chips, components and subsystems for the fiber optic sensing, broadband and specialty lasers market, announced today the introduction of the 2.5G SPECTRA-D 1310 nm SERIES, DFB Chip. The 2.5G SPECTRA-D 1310 SERIES will be on display at the CIOE in Shenzhen, China, in booth #6015 of Hall 6 at the Shenzhen Convention Center, September 6-9th, 2016.
The 2.5G SPECTRA-D 1310 SERIES represents the next level of evolution in the Denselight Portfolio of products, that will be widely deployed in the TWDM-PON, NGPON and GPON markets for FTTH and FTTX point of use. The introduction of these new products enables competitiveness and quality into the growing and expanding markets driven by consumers and mobile, internet, cloud-computing and IOT applications. DENSELIGHT's advanced and proven III-Voptoelectronics and PIC technology offers benchmark laser emitter solutions to meet the stringent and exact performance and reliability requirements as demanded by the communications market. The 2.5G SPECTRA-D 1310 SERIES is the first of several planned products on this platform, inclusive of products serving the 10G and 25G markets in 2017.
DENSELIGHT's 2.5G SPECTRA-D 1310 SERIES is a die level product offering to the broad market and to those customers who are ODM/OEM or Subcontractors to the data com laser market. At Denselight, we leverage our proprietary processing recipes for custom or semi custom solutions and for products that support the data communications market, and photonic sensing market. Our InP wafer fab can leverage enabling processes, to realize performance winning solutions. The 2.5G SPECTRA-D 1310 SERIES is an ideal product solution for passive optical network solution providers in FTTX networks in countries around the world.
"Our 2.5G SPECTRA-D 1310 SERIES is ideal for network systems providers that demand the highest-quality, economical delivery, optimum power management and excellent bandwidth capability for data transmission requirements," said, Bryan K. Patmon, Sr. Vice President of Marketing at DENSELIGHT. "The 2.5G SPECTRA-D 1310 SERIES augments our next step in technology for the transmitter market and will be adding advanced platform features to support DataComm markets as they migrate their networking needs to the latest technology.”
At CIOE, DENSELIGHT will be also showcasing its module level device portfolio for Broadband Applications ranging from 1270 nm to 1690 nm Broadband Products packaged in Butterfly/DIL Packaging, CoS (Chip on Submount) and Photodetectors. In addition, DENSELIGHT will be featuring its full line of Narrow Line Width Lasers, TO-56 ELED, and its full featured ILM product line.
DENSELIGHT will be meeting with customers, at our booth #6015 in Hall 6and we invite you to contact us if you would like to schedule a meeting.